What are the main components of Open Frame?

Open Frame is very important for electronic products, so there are many brands of power strips on the market. They are good and bad, and we need to carefully identify them when buying.

What are the main components of Open Frame?

What are the working levels of Open Frame?

What is the maintenance method of Open Frame?

What are the main components of Open Frame?

Open Frame mainly consists of pads, vias, mounting holes, wires, components, connectors, fillings, electrical boundaries, etc. The main functions of each component are as follows:

Pad: A metal hole for soldering component pins.

vias: There are metal vias and non-metal vias, where metal vias are used to connect component pins between layers.

Mounting holes: used to fix the board.

Wire: An electrical network copper film used to connect component pins.

Connector: A component used for connecting PCBs.

Filling: The copper used for the earth conductor network can effectively reduce the impedance.

Electrical limit: Used to determine the size of the circuit board, and all components on the circuit board must not exceed this limit.

What are the working levels of Open Frame?

Open Frame contains many kinds of working layers, such as signal layer, protective layer, screen printing layer, internal layer, etc. The functions of the different layers are briefly presented as follows:

⑴Signal layer: Mainly used for placing components or wiring. Protel DXP usually contains 30 interlayers, namely Mid Layer1~Mid Layer30.The interlayer is used for arranging signal lines, the deck and underlay for placing components or applying copper.

(2) Protective layer: It is mainly used to ensure that the places on the circuit board that do not need tin plating are not tin-plated, to ensure the reliability of the circuit board operation. Below are top paste and bottom paste the upper solder mask layer or bottom paste. the lower solder mask layer; Top Solder and Bottom Solder are the solder paste protection layer. the lower solder paste protection layer.

(3) Screen printing layer: It is mainly used to mark the serial number, production number, company name, etc. to print the components on the printed circuit board.

♬ Internal layer: Protel DXP is mainly used as a signal wiring layer and contains a total of 16 internal layers.

♬Other layers: mainly include 4 kinds of layers.

What is the maintenance method of Open Frame?

(1) Clean the Open Frame of dust quarterly. For cleaning, use the special cleaning solution for the board. After removing the dust on the PCB, use a hair dryer to dry the PCB.

(2) Observe whether the electronic components in the circuit have traces of high temperature and whether the electrolytic capacitor is curved and liquid has leaked, and if so, it should be replaced.

HIENT's head office is located in Lin Yi City, Shan Dong Province, China, and focuses on production, engineering and logistics. The design developed by our RD team (Su Zhou Design and Development Center) is transformed into products in four production facilities with 300 employees.